what's new

July 11, 2011

IMEC announces  printing of the first Extreme Ultra Violet (EUV)-light wafers with ASML NXE:3100 mounted with XTREME’s laser-assisted discharge plasma (LDP) source. For details, visit Imec News
(http://www2.imec.be/be_en/press/imec-news.html).

July 11, 2011

We at XTREME technologies are delighted to announce the renewal of our website today. We look forward to receiving your comments and feedback, in order to continuously enhance the website.

May 1, 2011

XTREME technologies GmbH will exhibit the laser-assisted discharge plasma (LDP) light source through a panel display  at SEMICON West 2011 to be held in Moscone Center in San Francisco from July 12 through 14. Please visit us at USHIO GROUP booth #2633 in South Hall. For details, contact Olivier Semprez at Mobile:
+49 (173) 67 44 748
+1 858 395 9123 (US)
E-Mail:osemprez@xtremetec.de

February 28, 2011

IMEC installs  ASML’s pre-production EUV scanner NXE:3100 mounted with XTREME’s laser-assisted discharge plasma (LDP) source. For details, visit Imec News (http://www2.imec.be/be_en/press/imec-news.html)

XTREME technologies GmbH develops, manufactures, markets and services EUV (Extreme Ultra-Violet) light sources for the semiconductor lithography market.

Together with our parent company USHIO INC., Tokyo, Japan, our goal is to extend Moore's Law by delivering powerful and reliable EUV light sources at 13.5 nm wavelength and thus paving the way for the semiconductor manufacturing of the coming decades.

XTREME's innovative solution - Laser-assisted Discharge Plasma (LDP) - combines the advantages of the traditional laser based and traditional discharge based technologies to generate EUV photons.

 

EUV

 

semicon 2011